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REINFORCED STRUCTURET-FORCE VULCAN Z is designed for complete protection and enhanced heat dissipation. The heat spreader is formed by the punch-press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with an electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. | ENHANCED HEAT DISSIPATIONWith superconductivity and thermally conductive adhesive, these memory modules can quickly transfer the heat on IC chip through heat conduction to the aluminum alloy cooling module for better heat dissipation. | STABLE AND DURABLEEvery IC chip made for TEAMGROUP's T-FORCE VULCAN Z DDR4 gaming memory is selected through a rigorous testing process. All overclocking memory is tested for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, optimal performance, stability and compatibility. |
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High performance, low power consumption and upgrade easilyIn addition to the increase in data transfer rate, the basic working voltage of the new generation of DDR4 memory is also decreased to 1.2V. | INTEL & AMD SUPPORTSIt is compatible to both Intel & AMD platforms, therefore gamers can build their system without worries. | SUPPORTS XMP2.0By using the XMP 2.0 technology, users are able to experience the thrill of overclocking easily. |
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